The main reason is that the flexible substrate could not undergo high-temperature processing above 200°C, except in some cases such as depositing films using plasma-enhanced atomic layer deposition under low temperature where plasma damage BI 10773 ic50 and degradation of the step coverage is

unavoidable [22]. In this letter, we fabricated a bilayer flexible RRAM device based on HfO2/Al2O3 films under low temperature, with resistive layers deposited using a low-temperature ALD process at 120°C and the electrodes sputtered by direct current (DC) magnetron reactive sputtering at room temperature. The devices fabricated by these methods exhibit impressive resistive switching characteristics with reliable data retention properties under room temperature and elevated temperature up to 85°C. Methods Flexible RRAM was fabricated on polyethylene terephthalate (PET) substrate coated by indium tin oxide (ITO) Inhibitor Library cell line conducting film, and ITO serves as the bottom electrode in our devices. During the process, the substrate was fixed on a 3-in wafer with polyimide tapes in order to maintain

sufficient mechanical support. The Al2O3 layer was deposited by 41 cycles of low-temperature ALD at 120°C with trimethyl aluminum (TMA) and water as precursors. Subsequently, the HfO2 Belnacasan layer was deposited by 67 cycles within the same framework using tetrakis(ethylmethylamino)hafnium (TEMAH) and water as precursors. TMA was pulsed at room temperature, and TEMAH was heated to 85°C to offer enough evaporation pressure. Al2O3 film was deposited with a pulse time of 0.1 and 0.2 s

for TMA and water, and the purging time for TMA and water was 5 and 20 s, respectively. The deposition method of HfO2 was derived from our previous work [23]. Finally, a 50-nm TiN top electrode was sputtered on the resistive layer by DC magnetron reactive sputtering through a metal shadow mask with a diameter of 400 μm. The thicknesses of the HfO2 and the Al2O3 layer were estimated to be 10.1 and 4.9 nm by Sopra GES5E spectroscopic ellipsometry. X-ray photoelectron spectroscopy (XPS) of HfO2 and Al2O3 on the PET substrate was performed using a Kratos Axis Ultra DLD XPS (Kratos Analytical, Ltd., Manchester, UK). Electrical properties at room temperature and at 85°C of the device were assayed using an Agilent Temsirolimus B1500A (Agilent Technologies, Inc., Santa Clara, CA, USA) semiconductor parameter analyzer and an Agilent B1525A high-voltage semiconductor pulse generator. Impedance of high and low resistance states was analyzed by an Agilent 4294A precision impedance analyzer. The device was tested with top biased and grounded bottom electrodes. Results and discussion The XPS spectra of HfO2 and Al2O3 films are respectively shown in Figure 1a,b. In Figure 1a, the binding energies of Al 2p in the bulk and at the surface of the Al2O3 film are both at 73.